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Most often in TTL and CMOS circuits of low and medium integration power pins are positioned diagonally, that is, the output with the maximum sequence number Nmax connected to a source of positive voltage +Ucc , and the output with the number Nmax/2 — to the common GND wire.
For such a case abroad developed special sockets with built-in capacitors (0.1 UF x 50 In), for example РF08К—РF40К or LC14К0—LC20К0 company Microparts-Garry Electronics.
However, a similar design can be made independently using a cheap plastic DIP sockets black manufacturing countries in Southeast Asia.
Capacitor C1 is located within the through-slot width of 2 mm (narrow panel) or 10 mm (wide panel). The height of the condenser should not be more than 5-5,5 mm, so as not to interfere with the installation of the chip. The value of C1 is selected in the range 0,015—0,15 µf at work with signals up to 10-20 MHz and 1000 pF and 0.01 µf on the higher frequencies.
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With no interference capacitor will not:
1 —socket DIP-16; 2 — built-in noise condenser
For a narrow socket can be used ceramic capacitors of type KM-5, K10-17. For a wide socket handy cylindrical capacitors A (mono-axial) with a diameter of 2.5— 3.8 mm and length 3.8—7.5 mm Philips (capacitance range 10 pF to 1 µf, working voltage 25-100).
The Assembly technology of particular complexity is no different. Initially, the contacts 8 and 16 of the socket gently push 1-2 mm above the surface and oblizyvaet side. The terminals of the capacitor are formed on the spot. Then solder them to the tinned surfaces. After that, a soldering iron gently pressed against the terminals of the capacitor in plastic body panels while simultaneously guiding a pair of tweezers contacts in the seats. Solder residue removed with a needle file. The link quality check using an ohmmeter.
Soldering should be minimal, despite the fact that the conclusions of the foreign sockets allow heating for 5 s at a temperature of soldering 260 °C.
Similarly, you can modify the sockets with pin count from 14 to 40. Their applications: breadboard, schematic, removable, ROM, RAM, devices with rich installation. In addition to saving space on the circuit Board such panels increases the noise immunity of the equipment where they are installed.
S. ROMIC, Chernigov, Ukraine